RTS Coplan for ADS

COPLAN FOR ADS is an EM-based simulation tool for the design of coplanar (M)MICs within HP Advanced Design System (ADS). An efficient Finite Difference Method (FDM) isutilized for the
accurate and broadband modeling of a comprehensive library of coplanar elements. 3D-effects such as metallization thickness and air bridges, as well as all process related parameters, are
taken into account. An automated and technology dependent layout generation is implemented for all elements. An efficient implementation of FDM together with a smart cache management
allows an accurate full 3D simulation in a very short time. As a result, an interactive optimization is possible. For the first time it becomes possible to design coplanar circuits accurately and
efficiently.

BACKGROUND: The kernel of COPLAN FOR ADS is based on an accurate field-theoretical modeling using a sophisticated 3D quasi-static finite difference calculation (FDM). The simulation
procedure is as follows: For each element in the library, a broadband model (equivalent circuit) is introduced. The model parameters are derived from electrostatic and magnetostatic field
distributions, which are calculated using a quasi-static 3D finite difference formulation for electric and magnetic potentials. Since it has been proven that coplanar structures only show marginal
dispersion effects, such a quasi-static calculation is even valid for very high frequencies. The 3D-FDM simulation considers for all effects such as limited ground planes, backside metallization,
cover and bottom plates and losses due to finite metallization thickness. In addition, all process related data, like different dielectric and resistive layer parameters are automatically considered
during the simulation and layout generation.